Life Prediction of Coated and Uncoated Metallic Interconnect for Solid Oxide Fuel Cell Applications
Xin Sun, Ph.D.
Pacific Northwest National Laboratory
P.O. Box 999，906 Battelle Boulevard Richland, WA 99354, United States
ABSTRACT cooling was predicted by comparing the predicted interfacial strength and the interfacial stresses induced by the cooling process from the operating temperature to room temperature, together with the measured oxide scale growth kinetics. It was found that the interfacial strength between the oxide scale and the Crofer 22 APU substrate decreases with the growth of the oxide scale, and that the interfacial strength for the oxide scale/spinel coating interface is much higher than that of the oxide scale/Crofer 22 APU substrate interface. As expected, the predicted life of the coated Crofer 22 APU is significantly longer than that of the uncoated Crofer 22 APU.